EDN

Hynix, ProMOS Look to Stack-Capacitor DRAMs

Hynix today said a term sheet has been signed for the licensing of certain stack-capacitor DRAM technology to ProMOS Technologies, which would also provide foundry services to Hynix. The companies ...
Design-Reuse

Toshiba cuts capacitor from DRAM cell design

TOKYO — Toshiba Corp. has developed a one-transistor, no-capacitor cell structure that it claims solves the difficulties encountered in producing DRAMs in sub-0.1-micron process technology. The ...
Mena FN

Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With &gt 400s Retention Time

(MENAFN- PR Newswire) LEUVEN, Belgium, Dec. 15, 2020 /PRNewswire/ -- This week, at the 2020 International Electron Devices Meeting, imec, a world-leading research and innovation hub in nanoelectronics ...
EDN

DRAM: the field for material and process innovation

Since its introduction, DRAM technology has been a commodity product driven by cost and razor-thin profits. DRAM's achievement over the years is extraordinary; its capacity in 1970 was 1 Kb and today ...
New Electronics

DRAM refresher: Problems the technology is set to encounter

But that highlights another weakness of DRAM; in order to deliver the capacities it has achieved, DRAM makes demands on process technology that make it difficult to mix with regular CMOS. The core of ...
Nasdaq

Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling

SANTA CLARA, Calif., May 05, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and ...
Electronic Design

SOI Drops The Capacitor, Doubles Embedded DRAM Density

But if you eliminate the capacitor, where is the charge that represents the data bit stored? That's the magic of SOI. The active circuit layer is isolated from the substrate, so there's a capacitive ...
Design-Reuse

Manufacturability, scalability: a critical test of SoC memories strategies

Since no one questions the performance benefits of embedding large memory blocks in SoCs, the only major issues to address are cost, time to market and design risk. Memory structures that are highly ...
Semiconductor Engineering

What’s Next For DRAM?

The DRAM business has always been challenging. Over the years, DRAM suppliers have experienced a number of boom and bust cycles in a competitive landscape. But now, the industry faces a cloudy, if not ...
Semiconductor Engineering

What’s Next For Memory?

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to integrate new memory schemes that provide more bandwidth at lower power. But there are some challenges ...
Electronic Design

Low-Power Embedded DRAM Sets Sights On SoC Designs

Targeting system-on-a-chip (SoC) applications, the company’s latest embedded DRAM operates at 1.2V and features a typical random access speed of up to 314 MHz with one clock latency and a typical page ...
sciencex

Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time

This week, at the 2020 International Electron Devices Meeting, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a novel dynamic random-access ...