KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
With a sales figure of 33,300 million in 2012, Continental AG is one of the world’s leading suppliers to the automobile industry. As a supplier of brake systems, systems and components for drive units ...
Application Note: Packaging Implementation and Solder Reflow R Guidelines for Pb-Free Packages XAPP427 (v2.0) September 16, 2004 Summar y Recent legislative directives and corporate driven initiatives ...
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