High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...

Next-generation automotive and power applications will benefit from a fully qualified family of high-reliability small-outline IC (SOIC) packages. The narrow-body packages provide zero delamination ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option. He had ...

The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked ...

The CPC2030 350-V solid-state relay comes in a 8-pin narrow SOIC, which is 40% smaller than the popular standard SOIC. The device is a dual 1-Form-A normally open switch and employs optically coupled ...

IXYS Corporation announced its new 60 V, dual and normally open solid-state relay with the highest current rating in a SOIC package. It provides 400 V of input-to-output isolation; and comprises two ...