Increased tax credits for chipmakers would further incentivize domestic semiconductor production; CMS Laser is on standby to provide sophisticated silicon processing solutions powered by lasers. Today ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

With Disco Corp. holding more than half of the global market for thin wafer processing and dicing equipment, the competitive landscape of this market is highly consolidated, finds Transparency Market ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

Track your investments for FREE with Simply Wall St, the portfolio command center trusted by over 7 million individual investors worldwide. Several analysts recently flagged Enovix (ENVX) for ...